A PLCC package is a common type of surface-mount integrated circuit (IC) package used in electronic devices.
PLCC stands for "Plastic Leaded Chip Carrier." It is a type of surface-mount integrated circuit (IC) package that is commonly used in electronic devices. The PLCC package has a square or rectangular shape, with leads (pins) that extend out from each of the four sides.
These packages are designed to be mounted directly onto the surface of a printed circuit board (PCB), either by soldering the leads or by plugging the package into a compatible socket.
Key Characteristics of PLCC Packages
Based on the definition and common usage, here are key aspects of PLCC packages:
- Name Origin: The name "Plastic Leaded Chip Carrier" describes its composition (plastic body), the presence of leads, and its function as a holder for an integrated circuit.
- Shape: Typically square or rectangular.
- Leads: Leads extend from all four sides. Unlike some other packages, PLCC leads are often J-shaped (bending underneath the package body), which allows for closer pin spacing and easier socketing or soldering.
- Mounting: Primarily designed for surface mounting onto a PCB.
- Usage: Commonly used in electronic devices for various types of ICs, including microcontrollers, memory chips, and logic circuits.
PLCC Applications
PLCC packages were particularly popular for components that might need to be easily replaced or updated, such as BIOS chips or programmable logic devices (PLDs), due to their compatibility with sockets. They are also widely used in permanent surface-mount applications where the component is soldered directly to the board.
Examples of components often found in PLCC packages include:
- Older microcontrollers
- EEPROMs and Flash memory chips
- Logic array devices
- Specific types of analog ICs
Advantages
- Suitable for high-density circuit boards.
- Compatible with sockets for easy replacement or testing.
- Robust leads compared to some other surface-mount packages.
Disadvantages
- The J-shaped leads can make visual inspection of solder joints more challenging compared to gull-wing leads found on packages like SOIC.
- May have limitations on pin count compared to very high-density packages like BGA.
PLCC packages have been a staple in electronics manufacturing for many years, offering a balance of density, ease of handling (especially with sockets), and reliability for a wide range of integrated circuits.
